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DTEND;TZID=Europe/Zurich:20220908T183000
UID:f9f07fe4fcae6ea00283fc4dde691e08
DTSTAMP:1775552290
LOCATION:ONLINE VIA ZOOM
ORGANIZER:EGYPlasma
DESCRIPTION:Nanotechnology is a revolutionary engine that will engender enormous changes in a vast majority of
today\'s industries and markets, while potentially creating completely new industries. The impact of
nanotechnology is particularly significant in the electronics industry, which is constantly driven by the need
for higher performance, increased functionality, smaller size and lower cost.
Historically, CMOS scaling has provided the means to realize higher performance increased
functionality, smaller size and lower cost. Scaling of CMOS technology continues in spite of tremendous
technology development barriers, design challenges and prohibitive costs. Soon, the 22nm CMOS
technology node is moving from development to high volume manufacturing while research and
development continues on future technology nodes including 16nm, 11nm and beyond. Fabrication of
Integrated-Circuits (IC) in these scaled technologies faces new challenges and limitations.
Since its introduction in the 1970s, plasma etching has become an integral part of semiconductor IC
fabrication. Driven by relentless pursuit of Moor’s law, plasma etching advances at a rate never seen before
in the history of this processing technology since its introduction to the IC industry. Challenges in plasma
etching are still coming from CMOS device fabrication. Increased complexity in plasma etching for silicon
nanoelectronics applications: introduction of multiple new materials, typical dimensions are less than few
ten’s of nanometers, large size wafers. Transistor gate dimension must be controlled with a precision in the
few nanometers range.
In this presentation, we will outline the plasma etching technology requirements in the
nanotechnology era from an industrial perspective.
URL;VALUE=URI:event.php?variableName=f9f07fe4fcae6ea00283fc4dde691e08
SUMMARY:Silicon Plasma Etching in the Nanotechnology Era: An Industrial Perspective
DTSTART;TZID=Europe/Zurich:20220908T173000
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